Hot Bar Soldering Design Rules

The parts are then cooled below the solidification temperature to form a permanent electro mechanical bond.

Hot bar soldering design rules.

Hot bar reflow soldering systems. Hot bar touches the leads 400 c hot bar touches kapton or 500 c ceramics and mc pcb soldering. But some materials ceramic substrates in particular need to be heated in a more controlled fashion to minimize the chance of cracking. Flex and pcb designs 1109 08 2010.

Although normal solder will melt at 180 c ideal solder temperature is above 220 c to get a good flowing and wetting behavior but below 280 c to prevent burning of the solder. Hot bar reflow soldering is a selective soldering process where two pre fluxed solder coated parts are heated using a heating element called a thermode or a hot bar to a sufficient temperature to melt the solder. Hot bar reflow soldering. The connection of the layers are favorably produced with flexible circuit carriers and or foil connectors these connections are prepared mostly by hot b ar reflow soldering.

The temperature of the stamp transfers the required heat into the joint to be soldered. Most pcb materials like fr2 and fr4 are very resilient to the application of heat during the hot bar reflow soldering or hot bar bonding process. Design tips for successful hot bar reflow soldering. Hot bar reflow soldering bonding fundamentals technical articles and whitepapers blogs videos training information and more.

Design tips for successful hot bar reflow. Excessive differences in the heat continue reading pcbs. Flex carriers and foil connectors. Solder must be pre tinned on pcb prior to hot bar process start point for screen printing is a 150 microns thick stencil with a mask opening that results in a 40 pad coverage for small pitch applications it is recommended to pre tin the parts by electro plating as being the most accurate technology.

The hot bar must be set higher due to the thermal transfer losses.